- 您现在的位置：买卖IC网 > Sheet目录130 > DPG10IM300UC (IXYS)DIODE HFRED 300V 10A TO-252DPAK
         DPG10IM300UC 1) IRMS is typically limited by the pin-to-chip resistance (1); or by the current capability of the chip (2). In case of (1) and a pr oduct with multiple pins for one chip-potential, the current capability can be increased by connecting the pins as one contact. Ratings Z Y Y WW Logo Part number Assembly Line abcdefg ProductMarking IXYS Date Code D = P = G = 10 = IM = 300 = UC = Part number Diode HiPerFRED extreme fast Single Diode TO-252AA (DPak) Current Rating [A] Reverse Voltage [V] Package Top °C TVJ °C 175 virtual junction temperature -55 Weight g 0.3 Symbol Definition typ. max. min. Conditions operation temperature Unit FC N 60 mounting force with clip 20 IRMS RMS current 20 A per terminal 1) 150 -55 TO-252 (DPak) Similar Part Package Voltage class DPG10I300PA TO-220AC (2) 300 Delivery Mode Quantity Code No. Part Number Marking on Product Ordering DPG10IM300UC 505682 Tape & Reel 2500 PAOGUI Standard Tstg °C 150 storage temperature -55 threshold voltage V 0.74 m? V0 max R0 max slope resistance * 14.5 Equivalent Circuits for Simulation T =VJ 175 °C I V0 R 0 Fast Diode * on die level IXYS reserves the right to change limits, conditions and dimensions. 20131125a Data according to IEC 60747and per semiconductor unless otherwise specified ? 2013 IXYS all rights reserved |